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0.60Mm Height 0603 Package Multi color Chip LED Hyper Red and Super Yellow Green

DOUBLE LIGHT ELECTRONICS TECHNOLOGY CO.,LTD

0.60Mm Height 0603 Package Multi color Chip LED Hyper Red and Super Yellow Green

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Brand Name : Double Light

Model Number : DL-PCBE0603SRYGC

Certification : RoHS/ REACH

Place of Origin : China

MOQ : 3,000pcs/Real

Price : US$ 0.015-0.025per unit (Pieces)

Payment Terms : Telegraphic Transfer in Advance (Advance TT, T/T)

Supply Ability : 2,000,000pcs per day

Product Name : 0603 Package Hyper Red and Super Yellow Green Bi-color (Multi-color) Chip LED

Package : 0603 Package SMD LED

Emitted Color : Hyper Red & Super Yellow Green

Product number : Hyper Red and Super Yellow Green Bi-color

Color Temperature : Red:632nm,Super Yellow Green:575nm

Lens Type : Water Clear

Forward Voltage @20ma : Red:1.8-2.8V, Super Yellow Green:1.8-2.8V

Viewing Angle : Red:120 Deg, Super Yellow Green:120 Deg

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0.60Mm Height 0603 Package Multi color Chip LED Hyper Red and Super Yellow Green

DL-PCBE0603SRYGC.pdf

This is our 0.60mm Height 0603 Package Hyper Red and Super Yellow Green Bi-color (Multi-color) Chip LED,its emitting color is able Bi-color and Multi-color. The SMD 0603 LED is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained.

Part No. Chip Material Lens Color Source Color
DL-PCBE0603SRYGC R AlGaInP Water Clear Hyper Red
G AlGaInP Super Yellow Green

Notes:

1. All dimensions are in millimeters (inches).

2. Tolerance is ± 0.10mm (.004″) unless otherwise specified.

3. Specifications are subject to change without notice.

Features:

  • Package in 8mm tape on 7″ diameter reel.
  • Compatible with automatic placement equipment.
  • Compatible with infrared and vapor phase reflow solder process.
  • Bi-color type.
  • Color: Blue & Hyper Red.
  • The product itself will remain within RoHS compliant Version.

Descriptions:

  • The SMD 0603 LED is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained.
  • Besides, lightweight makes them ideal for miniature applications, etc.

Applications:

  • Automotive: Backlighting in dashboard and switch.
  • Telecommunication: Indicator and backlighting in telephone and fax.
  • Flat backlight for LCD, switch and symbol.
  • Status indicator.
  • General use.

Absolute Maximum Ratings at Ta=25℃

Parameters Symbol Emitting Color Max. Unit
Power Dissipation PD Hyper Red 65 mW
Super Yellow Green 75

Peak Forward Current

(1/10 Duty Cycle, 0.1ms Pulse Width)

IFP Hyper Red 100 mA
Super Yellow Green 100
Continuous Forward Current IF Hyper Red 25 mA
Super Yellow Green 30
Reverse Voltage VR 5 V
Electrostatic Discharge (HBM) ESD 2000 V
Operating Temperature Range Topr -40℃ to +80℃
Storage Temperature Range Tstg -40℃ to +85℃
Soldering Temperature Tsld 260℃ for 5 Seconds

Electrical Optical Characteristics at Ta=25℃

Parameters Symbol Emitting Color Min. Typ. Max. Unit Test Condition
Luminous Intensity IV Hyper Red 50 100 --- mcd

IF=20mA

(Note 1)

Super Yellow Green 50 80 ---
Viewing Angle 1/2 Hyper Red --- 120 --- Deg

IF=20mA

(Note 2)

Super Yellow Green --- 120 ---
Peak Emission Wavelength λp Hyper Red --- 632 --- nm IF=20mA
Super Yellow Green --- 575 ---
Dominant Wavelength λd Hyper Red --- 624 --- nm

IF=20mA

(Note 3)

Super Yellow Green --- 573 ---
Spectral Line Half-Width △λ Hyper Red --- 20 --- nm IF=20mA
Super Yellow Green --- 20 ---
Forward Voltage VF Hyper Red 1.80 2.20 2.80 V IF=20mA
Super Yellow Green 1.80 2.20 2.80
Reverse Current IR Hyper Red --- --- 10 µA VR=5V
Super Yellow Green

Notes:

1. Luminous Intensity Measurement allowance is ± 10%.

2. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.

3. The dominant wavelength (λd) is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device.

Typical Electrical / Optical Characteristics Curves

(25℃ Ambient Temperature Unless Otherwise Noted)

Hyper Red:

Super Yellow Green:

Reliability Test Items And Conditions:

The reliability of products shall be satisfied with items listed below:

Confidence level: 90%.

LTPD: 10%.

1) Test Items and Results:

No. Test Item Test Hours/Cycles Test Conditions Sample Size Ac/Re
1 Resistance to Soldering Heat 6 Min

Tsld=260±5℃,

Min. 5sec

25pcs 0/1
2 Thermal Shock 300 Cycles

H: +100℃ 5min ∫ 10 sec

L: -10℃ 5min

25pcs 0/1
3 Temperature Cycle 300 Cycles

H: +100℃ 15min ∫ 5min

L: -40℃ 15min

25pcs 0/1
4 High Temperature Storage 1000Hrs. Temp: 100℃ 25pcs 0/1
5 DC Operating Life 1000Hrs. IF=20mA 25pcs 0/1
6 Low Temperature Storage 1000Hrs. Temp: -40℃ 25pcs 0/1
7 High Temperature/ High Humidity 1000Hrs. 85℃/85%RH 25pcs 0/1

2) Criteria for Judging the Damage:

Item Symbol Test Conditions Criteria for Judgment
Min Max
Forward Voltage VF IF=20mA --- F.V.*)×1.1
Reverse Current IR VR=5V --- F.V.*)×2.0
Luminous Intensity IV IF=20mA F.V.*)×0.7 ---

*) F.V.: First Value.

Reel Dimensions:

Carrier Tape Dimensions:

Loaded quantity 4000 PCS Per reel.

Please read the following notes before using the product:

1. Over-current-proof

Customer must apply resistors for protection, otherwise slight voltage shift will cause big current change (Burn out will happen).

2. Storage

2.1 Do not open moisture proof bag before the products are ready to use.

2.2 Before opening the package, the LEDs should be kept at 30℃ or less and 90%RH or less.

2.3 The LEDs should be used within a year.

2.4 After opening the package, the LEDs should be kept at 30℃ or less and 70%RH or less.

2.5 The LEDs should be used within 168 hours (7 days) after opening the package.

2.6 If the moisture adsorbent material (silica gel) has fabled away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions. Baking treatment: 60±5℃ for 24 hours.

3. Soldering Condition

3.1 Pb-free solder temperature profile.

3.2 Reflow soldering should not be done more than two times.

3.3 When soldering, do not put stress on the LEDs during heating.

3.4 After soldering, do not warp the circuit board.

4. Soldering Iron

Each terminal is to go to the tip of soldering iron temperature less than 260℃ for 5 seconds within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal. Be careful because the damage of the product is often started at the time of the hand solder.

5. Repairing

Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used (as below figure). It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing.

6. Caution in ESD

Static Electricity and surge damages the LED. It is recommended to use a wrist band or anti-electrostatic glove when handling the LED. All devices, equipment and machinery must be properly grounded.


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